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Amphenol ICC's Metral® headers and receptacles offer high contact density of 250 contacts per 100mm connector length and a contact pitch of 2mm.
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The High Pin Count Backplane Connectors from Amphenol ICC is a traditional backplane interface providing rugged mechanical and electrical performance.
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Ammphenol ICC's X2's upgraded platform maintains backwards mating interface compatibility with existing XCede
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The Amphenol ICC's cStack high speed solderless interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. Custom cStack Flex Assemblie
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Amphenol' ICC's VHDM connector's modular format and breadth of components provides unmatched design flexibility. VHDM can be combined with VHDM-HSD to incorporate both single-ended and differential signaling within the same connector.
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Amphenol ICC's VHDM-HSD is a shielded, high-density, high-speed press-fit connector system optimized for differential pair architectures.
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Amphenol's GbX connector platform is a differential connector which provides flexible and low-cost design solutions for lower speed applications while providing backwards mate compatible upgrades to allow for up to 14 Gbps. The wide breadth of components
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The Aptera connector from Amphenol ICC meets difficult electronic packaging challenges with a high-speed interconnect designed specifically for space constrained area without impeding airflow.
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Amphenol ICC's Crossbow allows designers to take advantage of all the benefits associated with orthogonal mid-plane architectures as the differential pairs on each side of the mid-plane share vias creating a straight pass-through connection.
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Amphenol ICC's Paladin's revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects.
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Amphenol ICC's ExaMAX delivers High Speed Interconnect Solution and offers a broad range of system architectures, including backplane, midplane, direct orthogonal, cabled backplane, coplanar and mezzanine etc.
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The high density and high speed MEG-Array Mezzanine Connector fro Amphenol ICC offers in a variety of PCB mezzanine stack heights with flexible ground distribution to optimize high speed signal integrity.